Menu
Media releases are provided as is by companies and have not been edited or checked for accuracy. Any queries should be directed to the company itself.
  • 24 April 2019 21:27

Dual Layer Lead Frame Segment In The Global Lead Frame Market Is Expected To Register Highest Share In The Target Market And Is Expected To Register CAGR Of Over 3%

Lead Frame Market By Type (Single Layer Lead Frame, Dual Layer Lead Frame, Multi-Layer Lead Frame) By Application (Consumer Electronics Equipment, Commercial Electronics Equipment, Industrial Electronics Equipment) And Region - Global Forecast To 2026

Introduction:

Lead frame is a metal frame which is considered the foundation of semiconductor packaging that supports an integrated circuit die or chip. It consists of bonding material made of aluminum or copper. Lead frame helps in easy circuit connection of the IC chip to other electrical contacts or components. Main functions of lead frame include connection of circuit, dissipation of heat, and provides mechanical support. Manufacturing process of lead frame comprises of photo etching, stamping and others. Selection of the manufacturing process is completely dependent on the volume of lead frame that need to be produced. Photo etching is mainly used for low and medium volume range while stamping is in production of high volume content.

Global Lead Frame Market Dynamics:

Increasing demand for semiconductor and integrated circuit (IC) packaging is a major factor driving growth of the global Lead Frame Market. Lead frames are primarily used in semiconductor packages. Majority of integrated circuit packaging is produced by placing the silicon chip on a lead frame, then wire bonding the chip to metal leads of that lead frame, after which the chip is coated with plastic. This technique is simple and enables low-cost packaging for many applications. Many types of packages are based on lead frames such as QFN, QFP, LQFP, TQFP, PLCC, SOIC, and TSOP. Quad-flat no-leads (QFN) serves as an alternative to costlier laminate-based chip scale packages, fine-pitch ball grid array (FBGA), flex ball grid array (FxBGA), and micro BGA in portable applications such as cellular handsets and personal digital assistants (PDAs). In addition, they provide excellent thermal performance through the exposed lead frame pad, which enables a direct thermal path for removing heat from a package. This thermal enhancing feature can be further taken advantage of when package lead frame pad is soldered to a board.

The global lead frame market is segmented on the basis of product type, application, and region.

Analysis by Product Type:

Among all type segments, the dual layer lead frame segment in the global lead frame market is expected to register highest share in the target market and is expected to register CAGR of over 3% over the forecast period, owing to its cost-effectives as compared to other type segments.

Analysis by Application:

Among all the application segments, the consumer electronics equipment segment is projected to register highest CAGR of over 3% and is expected to continue its dominance over the forecast period, owing to increasing penetration of smartphones across the globe and rising spending power of individuals especially in the developed economies.

Analysis by Region:

The market in China is expected to account for highest share in terms of revenue in the global lead frame market, expanding at a CAGR over 3% from 2017 to 2026. The market in Southeast Asia is expected to account for second-highest share in the target market over the forecast period. The market in North America is expected to witness significant growth over the forecast period in the global lead frame market.

Submit a media release